LogoSubstrate

0.0003″ tolerance

Held across 11,400 connectors — last audit cycle

Corroded RF shield before strip-and-replate — green oxidation, lifting solder mask, failed vendor spec
Before — Failed vendor spec
RF shield after full strip-and-replate cycle — nickel-bright surface, inspection-ready, NADCAP compliant
After — Substrate process

Drag to compare · Strip, plate, coat, cure

Proof before prose

The numbers your
QA team will print out.

XRF measurement gun on gold tab connector in clean room, measuring plating thickness in real time

Process Control

XRF thickness verification — every lot, every layer

Clean room environment showing precision plating racks with aerospace connectors in rinse tank

Statistical Process Control

ISO Class 7 clean room — no airborne contamination tolerance

Rack of aerospace connectors dripping from the rinse tank, freshly plated and ready for inspection

Cycle Time

Continuous-flow line — no batch queuing delays

Engineer reviewing NADCAP audit documentation and certification binders in quality lab

Compliance

Zero surveillance findings — last three NADCAP cycles

Client Outcomes

What staying with the
wrong vendor costs.

Satellite RF SystemsTier-2 Aerospace Supplier
0PPM

Rejection rate — 14,200 connectors over 6 months

KovarENIGAMS 2422NADCAP

The Situation

Previous vendor delivered 3 consecutive lots with gold thickness outside AMS 2422 spec on gold-finger connectors. Program hold triggered. Requalification audit scheduled in 11 days.

Substrate Result

Full first-article documentation delivered in 72 hours. Requalification audit passed without findings. Program back on schedule within two weeks of first lot delivery.

Surgical Robotics — 510(k) TrackMedical Device OEM
58 days

Qualification-to-delivery, including full IPC documentation

FR-4Matte TinBarrier NickelISO 13485

The Situation

EMS partner flagged tin whisker risk on RF shielding panels 60 days before 510(k) submission. Needed full conversion to matte tin + barrier nickel, with IPC-4552 documentation, without slipping the FDA window.

Substrate Result

510(k) submission met on original date. FDA reviewer cited complete finish traceability package as exemplary documentation. Zero resubmission cycles.

Defense Electronics — Multi-PlatformEMS Operations Director
4.1 days

Average turnaround — 23 consecutive lots

CopperSelective GoldTin-LeadAS9100D

The Situation

Current plater averaging 12-day turnaround on selective gold plating. Contract delivery windows required 5 days. Three programs simultaneously at risk of T&M penalties.

Substrate Result

All three programs delivered within contract windows. Penalty exposure eliminated. Now primary plating source for six additional platforms at the same OEM.

Ready to stop requalifying?

Tell us your substrate and finish.
We'll tell you exactly what we can hold.

Compliance Framework

11 active certifications.
Zero surveillance findings.

NADCAPChemical Processing2024
AS9100DAerospace QMS2024
ISO 9001Quality Management2024
ISO 13485Medical Devices2024
AMS 2404Electroless NickelActive
AMS 2423Nickel PlatingActive
AMS 2460Plating, ChromiumActive
IPC-4552ENIG StandardActive
J-STD-003SolderabilityActive
MIL-PRF-55110Rigid PCBActive
REACH/RoHSComplianceCurrent

All certifications maintained with zero lapse since 2019. NADCAP audit reports, AS9100D quality manual, and first-article documentation packages available on request for vendor qualification packages.

All certs current · Feb 2026